doc. no : qw0905-LVY3833-PF rev. : a date : 16 - feb. - 2006 data sheet lead-free parts LVY3833-PF super bright round type led lamps pb ligitek electronics co.,ltd. property of ligitek only
-30 30 100% -60 25% 75%50%75% 25% 0 50%100% 60 directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. LVY3833-PF package dimensions 5.6 5.0 25.0min 0.5 typ 0 1.0min 2.54typ + - 8.7 7.7 1.5max ligitek electronics co.,ltd. property of ligitek only page 1/5
ligitek electronics co.,ltd. property of ligitek only unit vy ratings mw ma a v 60 75 10 2000 30 ma page 2/5 -40 ~ +100 12 min. min.max. 2200 1.7 2.6 20 590 4000 typ. dominant wave length dnm luminous intensity @20ma(mcd) viewing angle 2 1/2 (deg) forward voltage @20ma(v) spectral halfwidth nm -40 ~ +85 parameter power dissipation peak forward current duty 1/10@10khz reverse current @5v electrostatic discharge( * ) forward current storage temperature emitted yellow LVY3833-PF algainp part no material operating temperature absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. tstg water clear lens color i f t opr ir pd i fp symbol esd static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LVY3833-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 typical electro-optical characteristics curve vy chip page3/5 part no. LVY3833-PF
60 seconds max 25 0 0 2 /sec max preheat 50 120 260 100 time(sec) 150 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) temp( c) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. LVY3833-PF
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description ligitek electronics co.,ltd. property of ligitek only 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition operating life test test item reliability test: reference standard mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 page 5/5 part no. LVY3833-PF
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